UMC贏得高通先進封裝訂單，挑戰台積電的領導地位
據《經濟日報》報導，聯合微電子（UMC）獲得了高通（Qualcomm Inc）的一項重要合同，專注於先進封裝技術，這標誌著高效能計算（HPC）領域的一次重大突破。這一舉動使UMC在人工智能（AI）個人電腦、汽車應用及快速增長的AI伺服器市場中扮演了關鍵角色，報導中還提到高帶寬記憶體（HBM）整合也在計劃中。
此項發展挑戰了台灣半導體製造公司（TSMC）在先進封裝領域的長期主導地位。報導指出，高通將使用TSMC的先進製程來生產芯片，但選擇UMC進行基於混合鍵合技術的晶圓級先進封裝。UMC的晶圓對晶圓（WoW）混合鍵合工藝能實現芯片間的整合，減少信號傳輸距離，從而在不升級製造工藝的情況下提升計算性能。
為了加強其市場地位，UMC積極推動先進封裝生態系統，與子公司Faraday Electronics和Silicon Systems，以及記憶體合作夥伴Winbond展開合作。這一最新訂單使UMC在長期由TSMC控制的市場中獲得了可觀的增長機會。
UMC在矽材超精密製造和2.5D/3D芯片堆疊整合等方面的能力，符合高通對先進HPC應用的需求。報導指出，利用UMC的先進封裝技術，對高通的新型高效能計算芯片的試產預計在2025年下半年開始，並計劃在2026年進入量產。
這一重大合同不僅為UMC帶來了新的增長動能，也重新塑造了先進封裝市場的競爭格局。
這一事件無疑為UMC的未來發展注入了強心針，尤其是在全球對高效能計算需求不斷上升的背景下。UMC能否借此機會擴大市場份額，挑戰TSMC的領導地位，將成為業界持續關注的焦點。這也顯示出技術創新和合作對於在快速變化的科技市場中保持競爭力的重要性。隨著AI和高效能計算的需求不斷上升，無論是UMC還是TSMC，都必須在技術和市場策略上不斷創新，才能在這場競爭中立於不敗之地。
以上文章由特價GPT API根據網上資料所翻譯及撰寫，過程中沒有任何人類參與 🙂
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